Process for fabricating electronic devices and image sensor

Metal working – Method of mechanical manufacture – Electrical device making

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Details

29412, 29832, 29840, 437207, 437209, H05K 302

Patent

active

053374746

ABSTRACT:
Input/output areas of device elements are provided at opposite ends of the original substrate, and two function areas are provided between the opposite input/output areas. The original substrate composing a large-size device is cut along lines in such a way that the input/output areas and the function areas are separated from one another. As a result, those portions of the original substrate where no function areas are to be formed are reduced, thereby contributing to effective utilization of the surface of the substrate for increasing the number of sensor substrates that can be yielded from it. The process is improved in the shape and layout of the substrates for electronic devices to be obtained by cutting the large-area device formed on the substrate and it hence is capable of yielding a greater number of electronic device elements from the large-area device.

REFERENCES:
patent: 3864810 (1975-02-01), Hargis
patent: 4316320 (1982-02-01), Nogawa et al.
patent: 4426773 (1984-01-01), Hargis
patent: 4617729 (1986-10-01), Celnik
patent: 4893168 (1990-01-01), Takahashi et al.
patent: 5027505 (1991-07-01), Nakamura et al.
patent: 5133118 (1992-07-01), Lindblad et al.
IBM Technical Disclosure Bulletin vol. 10 No. 8 Jan. 1968, p. 1092 by A. E. Huard et al.

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