Stacked semiconductor package and method of fabrication

Details Stacked semiconductor package and method of fabrication Stacked semiconductor package and method of fabrication

1998-06-05

2000-02-01

Williams, Alexander Oscar

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

257680, 257685, 257723, 257738, 257777, 257781, 257700, 257774, 361792, 361361, 361374, 174255, H01L 2312, H01L 2302, H01L 2350, H05K 118

Patent

active

060206292

ABSTRACT:
A semiconductor package and a method for fabricating the package are provided. The package includes multiple substrates in a stacked configuration, each having a semiconductor die mounted thereon. Each substrate includes matching patterns of external contacts and contact pads formed on opposing sides of the substrate, and interconnected by interlevel conductors through the substrate. In the package, the external contacts on a first substrate are bonded to the contact pads on an adjacent second substrate, so that all of the dice in the package are interconnected. The fabrication process includes forming multiple substrates on a panel, mounting the dice to the substrates, stacking and bonding the panels to one another, and then separating the substrates from the stacked panels to form the packages.

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