Patent
1989-12-12
1991-01-08
Hille, Rolf
357 81, H01L 2334, H01L 2336, H01L 2346
Patent
active
049840665
ABSTRACT:
There is disclosed a wafer scale semi-conductor module stack comprising at least one wafer scale semi-conductor device mounted on each of the two surfaces of an electrical interconnect substrate, said devices having their active devices facing said substrate with means being provided whereby said substrate and said devices are electrically and mechanically attached, the opposing surfaces of said devices being the heat exchange surfaces wherein heat is removed by flowing two-phase cooling, and there being multiple substrates positioned parallel to each other and sharing a common axis, each substrate being spaced apart such as to provide a conduit between opposing devices for the flow of coolant and said conduits being fed by an input conduit with coolant discharge through an output conduit, said substrates being attached to common support posts.
REFERENCES:
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patent: 3573569 (1971-04-01), Davis et al.
patent: 3771027 (1973-11-01), Marek
patent: 3800190 (1974-03-01), Marek
patent: 3993123 (1976-11-01), Chu et al.
patent: 4712609 (1987-12-01), Iversen
patent: 4771366 (1988-09-01), Blake et al.
patent: 4867235 (1989-09-01), Grapes et al.
patent: 4873613 (1989-10-01), Iversen
"Liquid Jet Cooling of Integrated Circuit Chips"--Sachar--IBM Technical Disclosure Bulletin, vol. 20, No. 9, Feb. 1978, pp. 3727-3728.
Clark S. V.
Coriolis Corporation
Hille Rolf
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