Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1995-06-07
1997-01-28
Ball, Michael W.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156285, 1563074, 156312, 264250, 264255, 264257, 264258, 264313, B32B 3104
Patent
active
055974350
ABSTRACT:
A mold system for a curable composite material. The mold receives the uncured plies of the composite material. A restraining member is attached to the mold to restrain a forcing member. The forcing member is positioned between the mold and the restraining member. At least a portion of the uncured plies are positioned between the mold and the forcing member. The forcing member is comprised of an elastomeric material having a high thermal coefficient of expansion. The assembly of plies, mold, forcing member and restraining member is placed in a furnace and heated. As the assembly is heated, the forcing member uniformly expands with increasing temperature. However, since the forcing member is constrained between the restraining member, whose purpose is to restrain the forcing member, the forcing member expands in a preselected direction determined by the shape of the mold, the forcing member, the composite part and the restraining member. The expansion however is limited by the mold. The result is that a pressure is uniformly applied to the composite material plies causing them to compact as the temperature is raised, uniformly increasing the pressure on the plies until the curing temperature is reached. The present invention also provides a method for molding a curable, laminated composite material plies comprised of fibers in a curable resin matrix.
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Bayer Timothy J.
Desautels John T.
Mora Juan R.
Ball Michael W.
Crispino Richard
General Electric Company
Hess Andrew C.
Narciso David L.
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