Land grid array assembly and related contact

Details Land grid array assembly and related contact Land grid array assembly and related contact

1998-02-12

2000-02-01

Stephan, Steven L.

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

With provision to conduct electricity from panel circuit to...

439515, 439 66, H01R 909

Patent

active

060196114

ABSTRACT:
An LGA type IC assembly is mounted on a PCB by means of a fastening means which sandwiches the LGA assembly and the PCB between two plates. Conductive contacts received in passageways defined through a socket of the assembly each have two engagement portions projecting beyond the outer surfaces of the socket to contact corresponding flat contact pads formed on an IC package and the PCB, a beveled edge on an upper portion of a main body thereof, and a C-shaped resilient beam extending from the main body and forming a slanted portion integrally formed with the upper engagement portion. The IC package delivers a normal force to each contact causing the upper engagement portion thereof to slide across a surface of a corresponding contact pad of the IC package thereby removing oxidation therefrom, while the slanted portion contacts the beveled edge thereby shortening the signal transmission path through each contact. A retaining means formed on the contact secures the contact within the passageway and allows for slight vertical movement thereof, thereby preventing signal loss due to warpage of the PCB.

REFERENCES:
patent: 4341433 (1982-07-01), Cherian et al.
patent: 4354729 (1982-10-01), Grabbe et al.
patent: 4906194 (1990-03-01), Grabbe
patent: 5154620 (1992-10-01), Martucci et al.
patent: 5713744 (1998-02-01), Laub

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