Optical semiconductor module and method for manufacturing same

Optical waveguides – With disengagable mechanical connector – Optical fiber to a nonfiber optical device connector

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385 88, G02B 636

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active

060195231

ABSTRACT:
It is an object of the invention to provide a optical semiconductor module, which is resisting against external noise and can be easily fabricated. The optical semiconductor module comprises an optical wave-guiding medium allocated on a substrate, a photosensor for optical to electrical converting the optical signal emitted from an output end of the optical wave-guiding medium, means for optically coupling the output end of the optical wave-guiding medium with a light-receiving surface of the photosensor, insulating resin for filling space surrounding an output part of the optical wave-guiding medium and the photosensor, and conductive resin, which is applied to the insulating resin and communicates with a ground plane connected with a ground terminal of the photo sensor. Insulting resin is composed of the first resin, which has a refractive index being the same as that of core of the optical wave-guiding medium, and fills a space between the output end of the wave-guiding medium and the light receiving surface of the photosensor, and the second resign, which is sealing resin for enclosing the first resin. Means for optically coupling is constituted of a mirror, which directs a light emitted from the optical wave-guiding medium to the photosensor.

REFERENCES:
patent: 5852696 (1998-12-01), Collins et al.
patent: 5940550 (1999-08-01), Plickert et al.
T. Ishii, et al., "Pigtail Type Optical Module by Transfer Molding", 1997 IEICE General Conference, C-3-62.

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