Molded selective plating mask

Details Molded selective plating mask Molded selective plating mask

1980-09-08

1981-10-13

Lawrence, Evan K.

Chemistry: electrical and wave energy

Apparatus

Electrolytic

204 15, C25D 1700

Patent

active

042946816

ABSTRACT:
An apertured plating mask having a polyurethane layer thereon to enhance the sealing thereof to a metal has been provided. The plating mask has a substantially smooth layer for contact with a metal as well as a polyurethane covering of the inner perimeter of the apertures of the plating mask whereby definition of selected areas for plating is enhanced. The apertured plating mask is fabricated by a unique molding process wherein a fabricated mask blank is positioned in a mold member, polyurethane is poured through and over the mask blank, cured and treated in the mold member to provide the apertured mask with a polyurethane layer having a substantially smooth surface. Also, a process and apparatus are provided for plating selected areas of a metal wherein a metal is contacted on one surface with a rubber-covered rigid plate and on the opposite surface with an apertured plating mask having a layer of polyurethane with a smooth surface thereon. A plating solution is applied through the apertures of the plating mask to selected areas of the metal as defined by the polyurethane and energized to provide the desired plated area.

REFERENCES:
patent: 3835017 (1974-09-01), Mentone et al.
patent: 3974056 (1976-08-01), Jogwick

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