Plastic and nonmetallic article shaping or treating: processes – Mechanical shaping or molding to form or reform shaped article – To produce composite – plural part or multilayered article
Patent
1998-02-05
2000-09-12
Ortiz, Angela
Plastic and nonmetallic article shaping or treating: processes
Mechanical shaping or molding to form or reform shaped article
To produce composite, plural part or multilayered article
26427215, 26427217, B29C 7070, B29C 7074
Patent
active
061173827
ABSTRACT:
The upper and lower mold plates of a transfer molding machine are configured for one-side encapsulation of a pair of substrate mounted electronic devices having an opposite conductor-grid-array and/or bare heat sink/dissipator. The pair of devices is positioned back-to-back within a single mold cavity for simultaneous encapsulation. A buffer member, optionally with cut-outs or apertures, may be placed between the two back-to-back substrates for protecting the grid-arrays and enabling encapsulation of devices with varying thicknesses without adjustment of the molding machine. Alternately, the upper and lower plates are configured for one-side encasement using covers of a pair of substrate mounted electronic devices having an opposite conductor-grid-array and/or bare heat sink/dissipator.
REFERENCES:
patent: 5034350 (1991-07-01), Marchisi
patent: 5114880 (1992-05-01), Lin
patent: 5147815 (1992-09-01), Casto
patent: 5222014 (1993-06-01), Lin
patent: 5239806 (1993-08-01), Maslakow
patent: 5313365 (1994-05-01), Pennisi et al.
patent: 5331205 (1994-07-01), Primeaux
patent: 5366364 (1994-11-01), Tanaka et al.
patent: 5458694 (1995-10-01), Nuyen
patent: 5488257 (1996-01-01), Bhattacharyya et al.
patent: 5578261 (1996-11-01), Manzione et al.
patent: 5597643 (1997-01-01), Weber
patent: 5598034 (1997-01-01), Wakefield
patent: 5608262 (1997-03-01), Degani et al.
patent: 5609889 (1997-03-01), Weber
patent: 5614441 (1997-03-01), Hosokawa et al.
patent: 5615089 (1997-03-01), Yoneda et al.
patent: 5646829 (1997-07-01), Sota
patent: 5755914 (1998-05-01), Yonehara
patent: 5830781 (1998-11-01), Acello et al.
Micro)n Technology, Inc.
Ortiz Angela
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