Test socket for testing integrated circuit packages

Details Test socket for testing integrated circuit packages Test socket for testing integrated circuit packages

1996-07-26

1998-09-15

Nguyen, Vinh P.

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

324765, G01R 3102

Patent

active

058084746

ABSTRACT:
A socket for testing an integrated circuit ball grid array package having external contacts formed by an array of solder balls is formed with a flexible bladder in the socket bottom. The upper side of the bladder has a test contact pattern that matches the pattern of the solder balls on the package. The side of the bladder carrying the test contact pattern is formed of conventional flexible circuit tape having contacts of spherical, conical or cylindrical shape formed thereon by conventional techniques, with circuit traces also formed on the flexible circuit tape extending to the outside of the socket for connection to test circuitry. Inflation of the bladder drives its test contact pattern against the solder balls of a package held in the socket and forces the flexible test contact substrate of the bladder to conform to any non-planar configuration of the ball grid array.

REFERENCES:
patent: 4099120 (1978-07-01), Aksu
patent: 4820976 (1989-04-01), Brown
patent: 5073117 (1991-12-01), Malhi et al.
patent: 5440240 (1995-08-01), Wood et al.
patent: 5475317 (1995-12-01), Smith
patent: 5568057 (1996-10-01), Kim et al.

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