Method of manufacturing an encapsulated semiconductor device wit

Details Method of manufacturing an encapsulated semiconductor device wit Method of manufacturing an encapsulated semiconductor device wit

1991-03-11

1992-11-24

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437224, 437906, 29 2501, 29869, 29873, 174 525, H01L 23055

Patent

active

051660989

ABSTRACT:
This semiconductor device has two leads (3) lying in the same axis, a prefabricated plastic can (1) which is filled with a plastic compound and has one of the leads passed through its bottom (1a), and a prefabricated die (4) attached between those sides of the inner ends (60, 70) of the leads (3) facing each other, the leads being inserted into, and having an offset within, the can. The manufacture of the leads starts with a wire (30) which unwinds from a spool (39), passes through a major part of the manufacturing stages unseparated, and is separated into the individual semiconductor devices only after the mounting of the cans (1).

REFERENCES:
patent: 2943359 (1960-07-01), Sussman
patent: 2964831 (1958-07-01), Peterson
patent: 3002133 (1961-09-01), Maiden et al.
patent: 3200311 (1965-08-01), Thomas et al.
patent: 4599636 (1986-07-01), Roberts et al.

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