Method of encapsulating an electronic device with a silicone enc

Details Method of encapsulating an electronic device with a silicone enc Method of encapsulating an electronic device with a silicone enc

1991-09-27

1992-11-24

Pianalto, Bernard D.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427387, 4274071, B05D 512

Patent

active

051659565

ABSTRACT:
A silicone rubber potting compound contains an alkoxysilane (.gamma.-glycidoxypropyltrimethoxysilane) as an adhesion promoter. Harmful effects caused by the adhesion promoter are alleviated by using as an additive a titanate having the form Ti(OR).sub.4, where R is an isopropyl, butyl, octyl, or acetylacetonate.

REFERENCES:
"Monolithic High Voltage Gated Diode Crosspoint Array IC," H. T. Weston et al., IEDM Technical Digest (International Electronics Device Meeting), San Francisco, Calif., Dec. 1982, pp. 85-88.
"Electrical Performance and Reaction Kinetics of Silicone Gels," C. P. Wong, Journal of Material Research, vol. 5, No. 4, Apr. 1990, pp. 795-800.
"Understanding the Use of Silicone Gels for Non-Hermetic Plastic Packaging," C. P. Wong et al., IEEE Transactions on Components, Hybrids, and Manufacturing Technology, vol. 2, No. 4, Dec. 1989, pp. 421-425.

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