Method of curing thin films of organic dielectric material

Details Method of curing thin films of organic dielectric material Method of curing thin films of organic dielectric material

1993-05-19

1994-12-27

Thomas, Tom

Fishing, trapping, and vermin destroying

20415764, 522164, H01L 2144, H01L 2148

Patent

active

053765869

ABSTRACT:
A method of curing an organic dielectric layer, such as polyimide, used in a multichip module is disclosed. The method comprises heating the uncured polyimide layer to a temperature above its glass transition temperature, and irradiating the layer with a uniform flux of electrons, as in an e-beam apparatus. The process reduces deterioration at the interface between the dielectric films and the metal layers which when high temperature thermal curing is utilized, and reduces the stress of the resulting film. Multiple dielectric layers can be applied in this manner.

REFERENCES:
patent: 4175963 (1979-11-01), Crivello
patent: 4339526 (1982-07-01), Baise et al.
patent: 4594315 (1986-06-01), Shibue et al.
patent: 4643910 (1987-02-01), Foutz
patent: 4719161 (1988-01-01), Kimura et al.
patent: 5024969 (1991-06-01), Reche
patent: 5057397 (1991-10-01), Miyabe et al.
patent: 5120634 (1992-06-01), Kobayashi

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