Copper thick film conductor composition

Details Copper thick film conductor composition Copper thick film conductor composition

1988-11-15

1989-09-12

Barr, Josephine

Compositions

Electrically conductive or emissive compositions

Free metal containing

252518, H01B 106

Patent

active

048657727

ABSTRACT:
A copper-containing thick film conductor composition comprising 55 to 95% by weight of an inorganic powder and 45 to 5% by weight of an organic medium, said inorganic powder comprising 100 parts by weight of a copper powder, 0.05 to 3 parts by weight of a zinc oxide powder, 1 to 7 parts by weight of a lead borate glass powder, 0.2 to 5 parts by weight of a borosilicate glass powder and 0 to 10 parts by weight of a copper snboxide powder having an average particle size of not more than 1.0 .mu.m. The composition of the present invention is excellent in solderability and adhesive strength to the substrate.

REFERENCES:
patent: 4172919 (1979-10-01), Mitchell
patent: 4323483 (1982-04-01), Rellick
patent: 4514321 (1985-04-01), Siuta
patent: 4521329 (1985-06-01), Siuta
patent: 4540604 (1985-09-01), Siuta
patent: 4623482 (1986-11-01), Kuo et al.
patent: 4687597 (1987-08-01), Siuta
patent: 4695403 (1987-09-01), Nishimura et al.

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