Wire bonding device

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Details

364488, 382 34, 382 8, 356392, 356397, 356399, 228 45, G06F 1560, G06K 964

Patent

active

048559288

ABSTRACT:
A wire bonding device including a camera for producing image signals corresponding to a field of view including an object having plural target patterns on which wire bonding is to be performed, a displacement device for altering the field view of the camera by varying the relative positioning between the camera and the object, a monitor for displaying an image of the object to be wire bonded, a reference mark display generation circuit coupled to the camera and the monitor for combining reference mark signals with the image signals so that an image of a reference mark is superimposed on the image of each target displayed by said monitor, a reference mark generation circuit for storing data corresponding to plural reference marks and for producing reference mark signals defining a selected reference mark and applying the reference mark signals to the reference mark display generation circuit, and an input selection and control device coupled to the reference mark generation circuit for selecting a reference mark shape and size tailored to each target pattern and for producing corresponding selection signals applied to the reference mark generation circuit, which then produces the reference mark signals in correspondance with the selection signals.

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patent: 4750836 (1988-06-01), Stein
Catalogue of Model 1471 High-Productivity Wedge Bonding System, Kulicke and Soffa Industries, Inc.
Sales Literature for Hughes HMC-2460 Automatic Wire Bonder.

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