Orthogonal chip mount system module and method

Details Orthogonal chip mount system module and method Orthogonal chip mount system module and method

1987-11-24

1989-08-08

James, Andrew J.

357 74, 357 71, 357 80, H01L 2316

Patent

active

048558095

ABSTRACT:
An orthogonal chip mount system module (10) comprising a base module (12), an interconnect chip (14), orthogonal slots (16) and semiconductor chips (18) is provided. The interconnect chip (14) is fixed to the base module (12) by high thermal conductivity epoxy. The semiconductor chips (18) are interference fitted into the slots (16). Solder pads (20) on the semiconductor chips (18) are aligned with solder pads (22) on the interconnect chip (14) and the system module (10) is then heated to the reflow temperature of the solder forming joints (24).

REFERENCES:
patent: 4237522 (1980-12-01), Thompson
patent: 4695872 (1987-09-01), Chatterjee

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