Winged self-fastened heat sinks for semiconductor devices

Details Winged self-fastened heat sinks for semiconductor devices Winged self-fastened heat sinks for semiconductor devices

1978-09-12

1980-07-29

James, Andrew J.

Heat exchange

With valve or movable deflector for heat exchange fluid flow

With by-pass of heat exchanger or heat exchanger section

357 68, 165 80A, 174 16HS, H01L 2302, H01L 2348, H01L 2944

Patent

active

042153611

ABSTRACT:
Heat accumulating about the plastic housing and metallic tab of a miniature electronic semiconductor power device is dissipated by a surrounding one-piece sheet metal heat sink shaped as a closely-fitting channel portion closed at the bottom but open-slotted midway along the top; from margins of the top slot, a pair of integral fingers spring downwardly to engage and hold a plastic semiconductor package within it, and from the same margins a pair of upwardly and laterally-flaring spaced broad-area fins are also spread to enhance transfer of heat away from the site at which a tab of a device is held within.

REFERENCES:
patent: 3247896 (1966-04-01), Chu et al.
patent: 3407868 (1968-10-01), Coe
patent: 3548927 (1970-12-01), Spurling
patent: 3572428 (1971-03-01), Monaco
patent: 3670215 (1972-06-01), Wilkens et al.
patent: 3893161 (1975-07-01), Pesak

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