Plastic and nonmetallic article shaping or treating: processes – Mechanical shaping or molding to form or reform shaped article – Shaping against forming surface
Patent
1974-09-06
1976-05-25
Hoag, Willard E.
Plastic and nonmetallic article shaping or treating: processes
Mechanical shaping or molding to form or reform shaped article
Shaping against forming surface
260 334P, 264329, B29G 300
Patent
active
039594335
ABSTRACT:
There is disclosed a thermosetting phenolic resin composition, suitable for use in injection molding, which resin composition contains a molding grade phenolic resin and an effective amount of a reactive compound (e.g., para-t-butylphenol) that is capable of reducing the viscosity of molding compositions containing said phenolic resin composition to a processable viscosity at a temperature at which the period of time within which said molding composition cures to a thermoset state is longer than the period of time that said molding composition is in the runner during a normal injection molding operation. There is also disclosed molding compositions containing said phenolic resin composition, and an injection molding process utilizing the same.
REFERENCES:
patent: 2736718 (1956-02-01), Webber
patent: 2809178 (1957-10-01), Turner et al.
patent: 2970121 (1961-01-01), Schmittberger
patent: 3299167 (1967-01-01), Knowlson et al.
patent: 3351605 (1967-11-01), Harvey
patent: 3660552 (1972-05-01), Hinz et al.
patent: 3812228 (1974-05-01), Skoroszewski
Randolph et al., Plastics Engineering Handbook, Reinhold, N.Y. (1965) pp. 36 and 37.
Hoag Willard E.
Metz Charles J.
Union Carbide Corporation
LandOfFree
Method of warm runner injection molding phenolic resins with par does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of warm runner injection molding phenolic resins with par, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of warm runner injection molding phenolic resins with par will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-906099