Enhanced cooling of a heat dissipating circuit element

Details Enhanced cooling of a heat dissipating circuit element Enhanced cooling of a heat dissipating circuit element

1997-05-28

1999-07-06

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361719, 257706, 257713, 257720, 257783, 174252, H05K 720

Patent

active

059204583

ABSTRACT:
An arrangement for cooling a heat dissipating circuit element mounted to a first side of a printed circuit board. A heat dissipation member is mounted to the other side of the circuit board and a thermally conductive post secured to the heat dissipation member extends through an aperture through the circuit board and into thermal contact with the circuit element.

REFERENCES:
patent: 4340902 (1982-07-01), Honda et al.
patent: 4729060 (1988-03-01), Yamamoto et al.
patent: 5014904 (1991-05-01), Morton
patent: 5172301 (1992-12-01), Schneider
patent: 5467251 (1995-11-01), Katchmar
patent: 5659458 (1997-08-01), Patchen

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