Method for coupling an electronic device into an electrical circ

Details Method for coupling an electronic device into an electrical circ Method for coupling an electronic device into an electrical circ

1983-08-08

1985-07-09

Goldberg, Howard N.

Metal working

Method of mechanical manufacture

Electrical device making

174 685, 228 62, 357 70, H01R 4300

Patent

active

045273308

ABSTRACT:
A method of coupling electronic devices into electrical circuits, particularly hybrid circuits and the like, by utilizing a pre-formed lead frame. The lead frame is formed from a gold film or the like and provides smooth width variations between the signal carrying lines of the circuit and the terminal portions of the device. Wobble bonding and wire bonding processes are adapted for use in practicing the invention. High frequency and/or wide band circuits are significantly improved by use of the present invention as opposed to prior art wire bonding techniques.

REFERENCES:
patent: 3554821 (1971-01-01), Caulton et al.
patent: 3614832 (1972-10-01), Chance et al.
patent: 3700156 (1972-10-01), Hermanns
patent: 3778685 (1973-12-01), Kennedy
patent: 3786375 (1974-01-01), Sato et al.
patent: 4037772 (1977-07-01), Dupuis
patent: 4071180 (1978-01-01), Dupuis
patent: 4246697 (1981-01-01), Smith

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