Method and apparatus for evaluating surface and subsurface featu

Optics: measuring and testing – For light transmission or absorption

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

356445, G01N 2141, G01N 2500

Patent

active

048547107

ABSTRACT:
A method and apparatus are disclosed for evaluating surface and subsurface features in a semiconductor sample. In operation, a periodic energy source is applied to the surface of the semiconductor sample to generate a periodic electron-hole plasma. This plasma interacts with features in the sample as it diffuses. The plasma affects the index of refraction of the sample and the changing plasma density is monitored using a radiation probe. In the preferred embodiment, the radiation probe measures the plasma induced periodic changes of reflectivity of the surface of the sample to yield information about the sample, such as ion dopant concentrations, residue deposits and defects.

REFERENCES:
patent: 4211488 (1980-07-01), Kleinknecht
patent: 4243327 (1981-01-01), Frosch et al.
patent: 4273421 (1981-06-01), Gurtler
patent: 4521118 (1985-06-01), Rosencwaig
patent: 4522510 (1985-06-01), Rosencwaig et al.
patent: 4579463 (1986-04-01), Rosencwaig et al.
patent: 4636088 (1987-01-01), Rosencwaig et al.
Shay, J. L., "Photoreflectance, Line Shape at the Fundamental Edge in Ultrapure GaAs", Physical Review B, vol. 2, No. 4 (Aug. 15, 1970), pp. 803-807.
Nilsson, N. G. "Reflectance Modulation in Ge and GeAs by Optical Carrier Injection", Solid State Communications, vol. 7, No. 5 (1969), pp. 479-481.
Cerdeira et al., "Photoreflectance and Electroreflectance in Silicon", Solid State Communications, vol. 7, No. 12 (1969), pp. 879-881.
Liu et al., "Picosecond Time-Resolved Plasma and Temperature-Induced Changes of Reflectivity and Transmission in Silicon", Appl. Phys. Lett., vol. 41, No. 7 (Oct. 1, 1982), pp. 643-646.
Auston, et al., "Picosecond Ellipsometry of Transient Electron-Hole Plasmas in Germanium", Physical Review Letters, vol. 32, No. 20 (May 20, 1974), pp. 1120-1123.
Opsal et al., "Thermal and Plasma Wave Depth Profiling in Silicon", Appl. Phys. Lett., vol. 47, No. 5 (Sep. 1, 1985), pp. 498-500.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method and apparatus for evaluating surface and subsurface featu does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for evaluating surface and subsurface featu, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for evaluating surface and subsurface featu will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-901472

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.