Method and arrangement for connecting a semiconductor to a subst

Details Method and arrangement for connecting a semiconductor to a subst Method and arrangement for connecting a semiconductor to a subst

1991-01-22

1992-10-27

Seidel, Richard K.

Metal fusion bonding

Process

Using a compliant cushioning medium

228243, 228 55, B23K 2002

Patent

active

051582260

ABSTRACT:
The invention is directed to a method wherein pressure is exerted onto a semiconductor surface by a chemically inert and non-solid medium. An opposite pressure is prevented from building up in an intermediate layer, for example, with the assistance of a seal. A connection between the semiconductor and the substrate occurs by pressure sintering or by diffusion welding. A contact between an active, inside region of the semiconductor and a plunger can be avoided since the plunger has a raised and annular outside region for sealing, and the actual pressing power is effected by the pressure medium via a bore situated in the plunger. This raised edge for sealing can also be situated on the semiconductor instead of being situated on the plunger. When a semiconductor component is extrusion-coated with a plastic melt, then this plastic melt itself can serve as a pressure medium.

REFERENCES:
patent: 3608809 (1968-08-01), Cushman
patent: 3699640 (1972-10-01), Cranston et al.
patent: 3964666 (1976-06-01), Dinella et al.
patent: 4159921 (1979-07-01), Inohara et al.
patent: 4638937 (1987-01-01), Belanger, Jr.
patent: 4810672 (1989-03-01), Schwarzbauer
patent: 4903885 (1990-02-01), Schwarzbauer
patent: 4903886 (1990-02-01), Schwarzbauer
Patent Abstracts of Japan; Publication No. 55103731; Koyama Osamu; "Manufacture of Semiconductor Device", Published Aug. 8, 1980.
Patent Abstracts of Japan; Publication No. 58068942; Takehashi Nobuhaya; "Die Bonding Device", Published Apr. 25, 1983.

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