Lead frame for semiconductor devices having improved adhesive bo

Details Lead frame for semiconductor devices having improved adhesive bo Lead frame for semiconductor devices having improved adhesive bo

1991-07-08

1993-05-25

Hille, Rolf

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

257666, 257782, 257783, H01L 2314

Patent

active

052143074

ABSTRACT:
Described is a lead frame design which allows for greater control of adhesive thickness which bonds the die with the die paddle on the lead frame. A number of bumps on the surface of the lead frame contact the die, thereby keeping the die a controlled distance from the surface of the die paddle. A sufficient amount of adhesive is applied to the die paddle to ensure a minimum allowable contact of the die with the adhesive, and the adhesive with the lead frame. Enough force is applied to the surface of the die to allow contact between the die and the bumps on the surface of the inventive lead frame. The force applied to the surface of the die, therefore, has no effect on the thickness of the bond line, as long as some minimum amount of pressure is applied.

REFERENCES:
patent: 5081520 (1992-01-01), Yoshii et al.

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