Encapsulation of electronic components with poly(arylene sulfide

Details Encapsulation of electronic components with poly(arylene sulfide Encapsulation of electronic components with poly(arylene sulfide

1982-07-16

1988-11-01

Lowe, James

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

26427217, 26427218, 26433112, 428419, 428447, 524609, 525535, H05K 506

Patent

active

047821957

ABSTRACT:
Electronic components can be encapsulated with a poly(arylene sulfide) composition containing a mercaptosilane such as, for example, 3-mercaptopropyltrimethoxysilane.

REFERENCES:
patent: 3123495 (1964-03-01), Carpenter et al.
patent: 3297473 (1967-01-01), Bulbenko
patent: 3577346 (1971-05-01), McKeown
patent: 3702356 (1972-11-01), Hall
patent: 4176098 (1979-11-01), Needham
patent: 4269756 (1981-05-01), Su
patent: 4370292 (1983-01-01), Yanase et al.

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