Automatic visual measurement of surface mount device placement

Metal working – Method of mechanical manufacture – Electrical device making

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29840, 219 1041, 219 1043, 219 1057, 219 1065, 228103, 228105, 228179, 358101, H05K 330

Patent

active

049412566

ABSTRACT:
A method for inspecting the placement and alignment of surface mounted components on printed circuit boards during assembly. After the component is placed on the board, an infrared camera provides an image of leads on the component and corresponding soldering pads, to which the leads are to be soldered, on the board in a single exposure. The image is then processed by a computer and the position and orientations of the leads of the component with respect to the soldering pads are determined. As a result, any unsatisfactory misalignment of the component can be detected and defective printed circuit boards identified.

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IBM Tech Discl Bull, vol. 30, No. 7, Dec. 1987, pp. 381-382.

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