Mechanical supports for very thin stacked capacitor plates

Semiconductor device manufacturing: process – Making passive device – Stacked capacitor

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Details

438253, 438255, 438398, 438947, 438964, H01L 218242

Patent

active

059306408

ABSTRACT:
A stacked capacitor having very thin fins and subminimum dimension supports for the fins is described. The capacitor includes a stack of conductive layers on a substrate. A plurality of subminimum dimension trenches are formed in the stack and a columnar conductive layer lines the trenches in contact with alternate layers of the stack. An insulator lines these alternate layers and the columnar conductive layer and capacitively couples these alternate layers and the columnar conductive layer to a second plate layer that is formed between the alternate layers, within the columnar layers in the trenches, and extending between stacked capacitors.

REFERENCES:
patent: 5155657 (1992-10-01), Oehrlein et al.
patent: 5196365 (1993-03-01), Gotou
patent: 5254503 (1993-10-01), Kenny
patent: 5436186 (1995-07-01), Hsue et al.
patent: 5455204 (1995-10-01), Dobuzinsky et al.

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