Semiconductor device and method of manufacturing the same

Details Semiconductor device and method of manufacturing the same Semiconductor device and method of manufacturing the same

1998-03-18

1999-07-27

Picardat, Kevin M.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

438106, 438110, H01L 2144, H01L 2148, H01L 2150

Patent

active

059305991

ABSTRACT:
A semiconductor device comprises a square-shaped first semiconductor chip having a first LSI, a square-shaped second semiconductor chip having a second LSI, which is smaller in size than the first semiconductor chip and connected to the first semiconductor chip by face down bonding, and a square-shaped package made of a molding resin for packaging the first and second semiconductor chips. The respective centers of the first and second semiconductor chips are offset from each other, while the center of the second semiconductor chip is substantially coincident with the center of the molding resin.

REFERENCES:
patent: 5378656 (1995-01-01), Kajihara et al.
patent: 5569625 (1996-10-01), Yoneda et al.
patent: 5739053 (1998-04-01), Kawakita et al.

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