Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1996-10-17
1998-11-17
Tolin, Gerald P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
257668, H05K 720
Patent
active
058385452
ABSTRACT:
A high performance, low cost multi-chip module package using a heatsink as a substrate with thin film wiring techniques or multilayered wiring techniques for interconnection of the chips on the surface of the module and a solder column grid array or solder ball grid array for interconnection to the next level of packaging (printed circuit board). The columns or balls create a space between the board and module with the chips being in the space and provide the required interconnect density.
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Clocher Dennis F.
Daves Glenn G.
Elenius Peter M.
Lisowski Joseph J.
Sullivan Joseph M.
International Business Machines - Corporation
Soucar Steven J.
Tolin Gerald P.
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