Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Patent
1996-11-18
1998-11-17
Arroyo, Teresa M.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
257685, 257723, 257783, H01L 2302, H01L 2334, H01L 2348
Patent
active
058380612
ABSTRACT:
A semiconductor package of the present invention is light, thin, simple and small, and can have more than 500 pins. The package includes a substrate having a cavity and a plurality of internal leads to serve as an electrical path. A plurality of internal terminals is formed on the bottom of the cavity and is connected to one end of the internal leads. A plurality of external terminals is formed on the bottom surface of the substrate and is connected to the other ends of the internal leads. A conductive adhesive formed on the upper surfaces of the internal terminals, and a semiconductor chip with chip pads is bonded to the upper surfaces of the conductive adhesives. A molded body is formed in the cavity such that the semiconductor chip is surrounded or partially covered. At least one semiconductor chip can be mounted in the cavity.
REFERENCES:
patent: 4742385 (1988-05-01), Kohmoto
patent: 5001542 (1991-03-01), Tsukagoshi et al.
patent: 5136365 (1992-08-01), Pennisi et al.
patent: 5290197 (1994-03-01), Ohnuma et al.
patent: 5381039 (1995-01-01), Morrison
patent: 5608261 (1997-03-01), Bhattacharyya et al.
Arroyo Teresa M.
LG Semicon Co. Ltd.
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