Cold plane system for cooling electronic circuit components

Details Cold plane system for cooling electronic circuit components Cold plane system for cooling electronic circuit components

1988-12-07

1990-12-04

Envall, Jr., Roy N.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

H05K 720

Patent

active

049758039

ABSTRACT:
The problem is dissipating heat from electronic circuit components is solved by a cold plane system which includes a generally flat housing (10) having a closed interior cavity and a generally flat exterior surface (16a) on which the electronic circuit components (12) are mountable. A pool (32) of liquid coolant fills a portion of the closed interior cavity in thermal communication with the exterior surface. An edge (42) of the housing remote from the pool of liquid coolant is adapted for thermal coupling to a cold chassis (36) to define a condenser means. The liquid is caused to boil from heat generated by the electronic circuit components. The resulting vapor is condensed by the condenser means, and the liquid condensate flows back to the pool of liquid coolant in a reflux manner. The housing is defined by a sandwich of a plurality of stacked plates (16a, 16b, 18a, 18b), with inner plates (18a, 18b) defining a porous core structure for the interior cavity. Preferably, over half the interior cavity is filled with the liquid coolant so that the cold plane is omni-directional.

REFERENCES:
patent: 4315300 (1982-02-01), Parmerlee et al.
patent: 4368779 (1983-01-01), Rojey et al.
patent: 4494171 (1985-01-01), Bland et al.
patent: 4624305 (1986-11-01), Rojey
patent: 4712158 (1987-12-01), Kikuchi et al.

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