Two-element semiconductor diode rectifier assembly structure

Details Two-element semiconductor diode rectifier assembly structure Two-element semiconductor diode rectifier assembly structure

1980-01-24

1982-05-04

James, Andrew J.

357 72, 357 75, 357 79, 357 81, H01L 2332, H01L 2328, H01L 2302

Patent

active

043285120

ABSTRACT:
To improve the stability and robustness of a rectifier and to protect it against atmospheric influences, two plate-like, series-connected semiconductor diodes are soldered to a common tap electrode between them. An external lead wire is soldered to each of the remaining sides of the diodes. The entire soldered structure is embedded in a single mass of resin or plastic, the ends of the electrodes being configured to serve as anchoring elements in the plastic mass.

REFERENCES:
patent: 2516344 (1950-07-01), Ross et al.
patent: 2897420 (1959-07-01), Butt
patent: 3179855 (1965-04-01), Brombaugh
patent: 3183407 (1965-05-01), Yasuda et al.
patent: 3486084 (1969-12-01), Zido
patent: 3713007 (1973-01-01), Waiter
patent: 3754169 (1973-08-01), Lyon et al.
RCA Technical Notes; Isolated Power Diode Assembly by Hausman; TN #841, pp. 1 and 2.

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