Bonding apparatus

Details Bonding apparatus Bonding apparatus

1998-07-17

2000-09-12

Heinrich, Samuel M.

Metal fusion bonding

Means to apply vibratory solid-state bonding energy to work

281101, B23K 2010, H01L 21607

Patent

active

061164909

ABSTRACT:
A bonding apparatus such as a die bonding apparatus in which a bonding tool at one end of an ultrasonic horn is given a vibration, the bonding apparatus being equipped with a Y-direction driver which has a Y-direction piezo-electric element that causes the bonding tool to vibrate in a Y-direction which is parallel to an axis of the ultrasonic horn, and an X-direction driver which has an X-direction piezo-electric element that causes the bonding tool to vibrate in an X direction which is on a plane perpendicular to the Y-direction, so that the piezo-electric elements are driven during bonding so that the bonding tool vibrates in the X- and Y-directions on the bonding plane.

REFERENCES:
patent: 4466565 (1984-08-01), Miyazima
patent: 5494207 (1996-02-01), Asanasavest

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