Severing by tearing or breaking – Methods
Patent
1997-04-23
2000-09-12
Dexter, Clark F.
Severing by tearing or breaking
Methods
225 93, 225103, 438461, H01L 2148, B26F 300
Patent
active
061164879
ABSTRACT:
A method of sweeping overflowed resin on a semiconductor device manufacturing process and an apparatus using the method are provided. The method comprises the steps of applying a breaking force to part of the top or back face of overflowed resin, which is leaked in resin-sealing the semiconductor device and stuck on the side wall surface of the lead, dam bar, etc. to be filled and hardened in each opening formed by the boundaries of the lead, dam bar, etc., so as to separate the overflowed resin into a separated resin piece and a residual resin remained sticking on the side wall surface of the lead, dam bar, etc.; making the separated resin piece come into contact with residual resin via the ruptured face; and applying a pressing-through force to part of the top or back face of the separated resin piece in the opposite direction to the breaking force to effectively separate and sweep at least part of the stuck residual resin via the separated resin piece.
REFERENCES:
patent: 37189 (1862-12-01), Westlake
patent: 2039840 (1936-05-01), Howland-Shearman
patent: 2039841 (1936-05-01), Howland-Shearman
Dexter Clark F.
Sony Corporation
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