High purity epoxy formulations for use as die attach adhesives

Details High purity epoxy formulations for use as die attach adhesives High purity epoxy formulations for use as die attach adhesives

1989-05-12

1990-12-04

Barr, Josephine

Compositions

Electrically conductive or emissive compositions

Free metal containing

252513, 252514, 252518, 252520, 252521, 523454, 523458, 523427, 428418, 428413, 156330, H01B 106

Patent

active

049752219

ABSTRACT:
This invention presents improved epoxy-based die attach adhesives which are of low viscosity, high ionic purity, and stable toward thermal cycling. This improvement is obtained by including in the formulation carboxy terminated polymers which are the reaction products of polyether diols with cyclic dianhydrides.

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Dietz et al. "An Innovation In Materials for Attaching Silicon Devices".
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C. C. Proctor, Paint and Resin, May/Jun., 1982, pp. 18-20.

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