Preolymerizing epoxy resin, functionalized rubber with filler to

Details Preolymerizing epoxy resin, functionalized rubber with filler to Preolymerizing epoxy resin, functionalized rubber with filler to

1997-06-23

1998-09-15

Sellers, Robert E.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

523434, 523457, 523459, 523467, 525527, 525529, 525530, 525531, C08K 322, C08L 902, C08L 6302

Patent

active

058079106

ABSTRACT:
An adhesive for a flexible printed circuit board and the method of preparing the same where the adhesive displays excellent migration inhibition, moisture adsorption resistance, and superior peeling strength, heat resistance, solvent resistance, chemical resistance, flexibility, and electrical properties. The adhesive is prepared by pre-polymerizing an epoxy resin, a COOH-containing rubber, a filler, and a primary catalyst in a solvent using a tertiary amine as a primary catalyst to form a prepolymer, followed by curing the prepolymer using a curing agent and a curing catalyst. The adhesive is coated on a plastic film, dried and laminated with a copper foil and then cured at an elevated temperature to form a substrate.

REFERENCES:
patent: 4465542 (1984-08-01), Furihata

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