Method of forming copper conductor

Details Method of forming copper conductor Method of forming copper conductor

1980-10-08

1982-05-04

Kendall, Ralph S.

Metal treatment

Compositions

Heat treating

148614R, 427 79, 427123, 4271261, 4271263, 427404, 4274191, C23F 702

Patent

active

043280480

ABSTRACT:
A structure of a copper conductor is obtained by oxidizing copper film formed on the surface of a substrate, and by heat treating the same in a reducing atmosphere, whereby only the surface layer portion of the oxidized copper film is reduced to become copper. The copper film of a conductor is formed on the surface of the substrate with the oxidized copper film interposed therebetween. As a result, an adhesion of the copper film to the surface of the substrate is enhanced.

REFERENCES:
patent: 1811603 (1931-06-01), Ackerly
patent: 2643199 (1953-06-01), Hersch
patent: 2893891 (1959-07-01), Bradstreet et al.
patent: 4189331 (1980-02-01), Roy
Kuemmerer, Chem. Abs., 78 P 1277912 (1973).
Tikhomirova et al., Chem. Abs. 77:130049y (1972).

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