Method of forming planarized layers in an integrated circuit

Details Method of forming planarized layers in an integrated circuit Method of forming planarized layers in an integrated circuit

1996-12-18

1998-11-17

Eley, Timothy V.

Abrading

Abrading process

Utilizing fluent abradant

451 41, 451 63, 451 8, B24C 108, B24B 4900

Patent

active

058368051

ABSTRACT:
A method of chemical mechanical polishing (CMP) useful in the manufacture of integrated circuits is disclosed. Waste slurry is examined and its conductivity, luminescence, or particulate mass evaluated to determine an endpoint for the CMP operation.

REFERENCES:
patent: 5664990 (1997-09-01), Adams et al.
patent: 5722875 (1998-03-01), Iwashita et al.
Schumacher, Rolf, Angewandte Chemie, "The Quartz Microbalance: A Novel Approach to the In-situ Investigation of Interfacial Phenomena at the Solid/Liquid Junction", pp. 329-343, vol. 29, No. 4, Apr. 1990.
Hillman, A. Robert, Swann, Marcus J., and Bruckenstein, Stanley, "General Approach to the Interpretation of Electrochemical Quartz Crystal Microbalance Data", J. Phys. Chem. 1991, pp. 3271-3277.
Buttry, D. A., Publication Electrochemistry in Electroanalytical Chemistry, "Applications of Quartz Crystal Microbalance to Electroanalyatical Chemistry", pp. 1-85, vol. 17.

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