Naphthalene containing epoxy resin cured with a dicyclopentadien

Details Naphthalene containing epoxy resin cured with a dicyclopentadien Naphthalene containing epoxy resin cured with a dicyclopentadien

1992-10-01

1994-05-17

Marquis, Melvyn I.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

525476, 525481, 525487, 525524, 525534, 528 98, 528103, 528104, C08F28300

Patent

active

053128788

ABSTRACT:
A thermosetting resin composition comprising (A) a naphthalene ring-bearing epoxy resin, (B) a dicyclopentadiene-modified phenolic resin, and (C) an inorganic filler is suitable for encapsulating semiconductor devices since the composition cures into a product having a low coefficient of expansion, good adhesion and low moisture absorption.

REFERENCES:
patent: 5001174 (1991-03-01), Yanagisawa et al.
patent: 5043211 (1991-08-01), Yoshizumi et al.
patent: 5108824 (1992-04-01), Wang et al.
patent: 5143951 (1992-09-01), Ohta et al.
patent: 5162400 (1992-10-01), Shiobara et al.

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