Plastic and nonmetallic article shaping or treating: processes – Direct application of electrical or wave energy to work – Limited to treatment of surface or coated surface
Patent
1997-05-09
1999-07-27
Ortiz, Angela
Plastic and nonmetallic article shaping or treating: processes
Direct application of electrical or wave energy to work
Limited to treatment of surface or coated surface
264478, 26427213, 26427217, B29C 4514, B29C 7070
Patent
active
059285982
ABSTRACT:
A method (38) for packaging a microelectronic device (10) and a device (10) packaged by the method (38). The method (38) includes a step of providing (42) a first material (16) on an active surface of the microelectronic device (10). The first material (16) has a first temperature coefficient of expansion. The method (38) also includes steps of heating (46) the microelectronic device (10) and the first material (16) to a predetermined first temperature and molding (48) a second material (20) about the microelectronic device (10) and the first material (16). The second material (20) has a second temperature coefficient of expansion less than that of the first material (16). A final step of cooling (50) the first material (16), the second material (20) and the microelectronic device (10) provides a packaged microelectronic device (30).
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An article entitled "Deposition Parameter Studies And Surface Acoustic Wave Characterization Of PECVD Silicon Nitride Films On Lithium Niobate", by Jacqueline H. Hines, Donald C. Malocha, Kalpathy Sundaram, Kevin J. Casey and Kwang R. Lee from IEEE vol., 42, No.3, May 1995.
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Anderson Michael John
Christensen Jeffrey Eames
Johnson Gary Carl
Popovich Mark Phillip
Cunningham Gary J.
Mancini Brian M.
Motorola Inc.
Ortiz Angela
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