Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1997-11-01
1999-07-27
Stemmer, Daniel
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
2940211, 156 92, 156 94, 428 63, B29C 7306
Patent
active
059284480
ABSTRACT:
The present invention is a dowel-adhesive method for repairing ceramic matrix composites. The dowel adhesive method embodied in the present invention incorporates both adhesive and mechanical bonding of a patch to a damaged CMC surface area. The damaged area is first identified and then pre-processed. Next, a CMC patch plug is produced and adhesively and mechanically bonded to the pre-processed area. Mechanical bonding is accomplished with dowel pins and corresponding dowel pin holes in the patch plug and the panel. The dowel pins anchor the CMC patch plug to the panel. Adhesive bonding is accomplished by placing a ceramic adhesive between the patch plug and the panel. Also, the dowel pins are adhesively bonded within the dowel pin holes of the plug and the panel. The ceramic adhesive is set by a low temperature cure (if required) and a high temperature firing.
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Anderson Terry J.
Hoch Jr. Karl J.
Northrop Grumman Corporation
Stemmer Daniel
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