Substrates to interconnect electronic components

Electricity: electrical systems and devices – Miscellaneous

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

174 685, 361401, 361406, H05K 118

Patent

active

046023186

ABSTRACT:
Substrates for interconnecting components in which a filament is applied and affixed to a base in a pre-determined pattern, the base surface and applied filaments are coated with a coating and the coating is hardened to form a substantially flat surface over the base and filaments. The coated base is then positioned on a table movable along "x" and "y" axes and the coated base is positioned under a high energy beam at pre-programmed points on the applied filament pattern and access openings are formed in the coating on the base at such points to expose the filament at each such point so that the exposed filament can be interfaced with the exposed surface of the coated base and articles for mounting and interconnecting components formed thereby.

REFERENCES:
patent: 3646246 (1972-02-01), Olney
patent: 3646572 (1972-02-01), Burr
patent: 3674602 (1972-07-01), Keogh et al.
patent: 3701838 (1972-10-01), Olney
patent: 4000558 (1977-01-01), Cahill
patent: 4065850 (1978-01-01), Burr et al.
patent: 4276775 (1981-07-01), Provasnik
O. R. Abolafia, Method of Connecting Layers of Circuitry Separated by a Dielectric, IBM Tech. Disc. Bull., vol. 22, #10, Mar. 1980, pp. 4471 & 4472.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Substrates to interconnect electronic components does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Substrates to interconnect electronic components, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Substrates to interconnect electronic components will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-868872

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.