Method for electroless copper-plating and a bath for carrying ou

Details Method for electroless copper-plating and a bath for carrying ou Method for electroless copper-plating and a bath for carrying ou

1983-12-15

1985-05-28

Smith, John D.

Coating processes

Immersion or partial immersion

Chemical compound reducing agent utilized

106 123, 106 126, 427 98, C23C 302

Patent

active

045200521

ABSTRACT:
A method for electroless copper-plating comprising immersing a surface to be plated in a conventional bath of an alkaline aqueous solution of a cupric salt, a complexing agent for cupric (II) ions and reducing agents which additionally contain an oxide inclusion preventing agent of the formula

REFERENCES:
patent: 3329512 (1967-07-01), Shipley
patent: 4171225 (1979-10-01), Molenaar
patent: 4211564 (1980-07-01), Oka
Saubestre, "Stabilizing Electroless Copper Solutions", Plating, June 1972, p. 563-566.
Concise Chemical and Technical Dictionary, Edited by Bennett, Chemical Publishing Co., 1974, pp. 92, 776, 669.

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