Self-aligning package for integrated circuits

Details Self-aligning package for integrated circuits Self-aligning package for integrated circuits

1975-08-04

1977-11-01

Truhe, J. V.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

29626, 204 15, H05K 500

Patent

active

040566811

ABSTRACT:
A self-aligning integrated circuit package includes an integrated circuit die having raised contact pads mounted to an interconnecting die in flip chip fashion. The interconnecting die is formed of anodizable material and has raised anodized portions that form guide means for aligning the integrated circuit die and the leads of a lead frame so that they are positioned over conductive portions of the interconnecting die which connect the contact pads of the integrated circuit to the leads of the lead frame.

REFERENCES:
patent: 3035990 (1962-05-01), Davis et al.
patent: 3374537 (1968-03-01), Doelp
patent: 3469684 (1969-09-01), Keady et al.
patent: 3544857 (1970-12-01), Byrne et al.
patent: 3659035 (1972-04-01), Planzo
patent: 3698074 (1972-10-01), Helda et al.
patent: 3741880 (1973-06-01), Shiba et al.
patent: 3832603 (1974-08-01), Cray et al.
patent: 3902148 (1975-08-01), Drees et al.

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