Snap-cure epoxy adhesives

Details Snap-cure epoxy adhesives Snap-cure epoxy adhesives

1998-05-05

1999-01-05

Wilson, Donald R.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

523427, 523459, 528103, C08L 6300, C08L 6104, C08K 310

Patent

active

058563830

ABSTRACT:
This invention relates to adhesive formulations, which can be snap-cured without loss of adhesive strength (as measured by die shear strength) and flexibility (as measured by radius of curvature), comprising 20-80 parts by weight of a flexible epoxy resin comprising an oligomeric backbone of alkylene or alkyleneoxy repeat units, terminated with an aromatic moiety bearing one or more epoxy functionalities, and 80-20 parts by weight of an aromatic O-glycidyl ether (to a total 100 parts), a curing catalyst, and optionally one or more fillers, and a phenolic hardener.

REFERENCES:
patent: 5536855 (1996-07-01), Schultz et al.
patent: 5646315 (1997-07-01), Schultz et al.
patent: 5703195 (1997-12-01), Schultz et al.
patent: 5770706 (1998-06-01), Wu et al.

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