Thermosetting resin composition

Details Thermosetting resin composition Thermosetting resin composition

1985-11-15

1987-01-27

Nielsen, Earl

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

From phenol, phenol ether, or inorganic phenolate

525109, 525502, 528 98, 528101, 528104, C08G 5962

Patent

active

046395032

ABSTRACT:
A thermosetting resin composition having an improved crack resistance comprising 100 weight parts of a curable epoxy resin and 30 to 300 weight parts of a phenol compound-added conjugated diolefin polymer, which is prepared in the presence of aluminum phenoxide as the catalyst. The composition is suitable for resin encapsulation of electronic components.

REFERENCES:
patent: 3069373 (1962-12-01), Greenlee
patent: 3770698 (1973-11-01), Riew
patent: 3966837 (1976-06-01), Riew
patent: 4388451 (1983-06-01), Culbertson et al.
patent: 4578425 (1986-03-01), Santorelli

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