Heat dissipating computer case having oriented fibers and heat p

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

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Details

16510433, 174 152, 361687, H05K 720

Patent

active

058186930

ABSTRACT:
The apparatus is a cooling structure for laptop computers, in which the heat is transferred to a heat pipe in the cover of the case behind the display screen. The heat pipe behind the screen is interconnected with the external wall of the cover by a holding fixture which, preferably, is integrated into the cover wall during manufacture. The cover is specially constructed with high thermal conductivity carbon fibers which are oriented to preferentially conduct heat from the heat pipe to the cover and to spread the heat over the entire external surface of the cover for dissipation into the environment.

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