Multilayer bonding and cooling of integrated circuit devices

Details Multilayer bonding and cooling of integrated circuit devices Multilayer bonding and cooling of integrated circuit devices

1989-12-27

1990-10-16

Picard, Leo P.

Electricity: electrical systems and devices

Miscellaneous

174 163, 174252, 361384, 361385, 361414, H05K 118

Patent

active

049640194

ABSTRACT:
A method to mount and cool integrated circuit chips within a multilayer printed wiring board structure. The method makes the use of tape automated bonding or flip chip dice attachment techniques in such a way that a cavity may be formed above and below the integrated circuit which will serve as a passage way for cooling.

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