Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent
1994-04-05
1995-01-10
Jackson, Jerome
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
257727, 257675, 257706, 165 802, H01L 2302, H01L 2340
Patent
active
053810414
ABSTRACT:
A self clamping heat sink for releasable connection to an electrical component having a bottom surface and a top surface. The self clamping heat sink includes a base and a pair of inverted U-shaped spring arms at opposite sides of the base which extend upwardly from the base. A clamping finger extends inwardly from the outer leg portion of each spring arm to a free end which overlies the base. The free ends of the spring arms are raised to an upper position relative the base by applying external force to squeeze the outer leg portions of the spring arm toward each other. This enables an electrical component to be placed on the base and below the free ends of the clamping fingers. When external force is removed from the spring arms, the clamping fingers try to return to their normal lower position and engage the top surface of the electrical component so that the electrical component is clamped between the base and the fingers.
REFERENCES:
patent: 3893161 (1975-07-01), Pesak, Jr.
patent: 4054901 (1977-10-01), Edwards et al.
patent: 4215361 (1980-07-01), McCarthy
patent: 4261005 (1981-04-01), McCarthy
patent: 5130888 (1992-07-01), Moore
Jackson Jerome
Kelley Nathan K.
Wakefield Engineering, Inc.
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