Process for manufacturing a circuit with filled holes

Details Process for manufacturing a circuit with filled holes Process for manufacturing a circuit with filled holes

1998-03-12

1999-12-14

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29846, 427 97, H01K 310

Patent

active

060001291

ABSTRACT:
Circuit boards are manufactured by forming a substrate with a dielectric surface, laminating a metal foil to the substrate, and forming holes in the substrate through the foil. A filler material with an organic base may be filled with electroconductive particles or dielectric thermoconductive particles. The filler material is deposited into the holes and is heated to at least partially cure it. The surface of the filler material is seeded and electrolessly plated to form a conductive coating on the metal foil and the filler material. The coating is then patterned to form a wiring layer. A second set of holes may be formed in the circuitized substrate after the hole filling step, which are also electrolessly plated.

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