Method of heat dissipation from two surfaces of a microprocessor

Details Method of heat dissipation from two surfaces of a microprocessor Method of heat dissipation from two surfaces of a microprocessor

1998-04-30

1999-12-14

Young, Lee W.

Metal working

Method of mechanical manufacture

Electrical device making

29832, 261717, 261709, 257720, 257719, H05K 330

Patent

active

060001259

ABSTRACT:
A natural heat dissipation device for a microprocessor. The microprocessor is conventionally mounted to a printed circuit board. The printed circuit board contains a recess that is cut-out directly below the microprocessor. Heat sink material is attached to the microprocessor through the recess. The heat sink material attached to the bottom of the microprocessor may be used alone or in conjunction with a an attached metal tray or case under the printed circuit board.

REFERENCES:
patent: 4509096 (1985-04-01), Baldwin
patent: 5311060 (1994-05-01), Rostoker
patent: 5386339 (1995-01-01), Polinski, Sr.
patent: 5464054 (1995-11-01), Hinshaw et al.
patent: 5533256 (1996-07-01), Call et al.

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