Process for forming a multilayer wiring conductor structure in s

Details Process for forming a multilayer wiring conductor structure in s Process for forming a multilayer wiring conductor structure in s

1993-10-04

1995-01-10

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437195, 437230, 257770, 257763, H01L 21443

Patent

active

053806794

ABSTRACT:
In a process for forming a multilayer wiring conductor structure, an interlayer insulator film is deposited on a surface including an upper surface of a lower layer wiring conductor, and the deposited interlayer insulator film is planarized so as to expose the upper surface of the lower layer wiring conductor. Then, a bonding metal film is deposited on a surface of the interlayer insulator film exposing the upper surface of the lower layer wiring conductor, and a photoresist film is coated on the bonding metal film and patterned. By using the patterned photoresist, a hole for formation of a connection pillar between the lower layer wiring conductor and a possible upper layer wiring conductor and a patterning of the bonding metal film are simultaneously formed. Accordingly, the bonding metal film can be formed and patterned on the upper surface of the lower layer wiring conductor without increasing the photolithography steps.

REFERENCES:
patent: 5173449 (1992-12-01), Lorenzen et al.
patent: 5202579 (1993-01-01), Fujii et al.
patent: 5225372 (1993-07-01), Savkar et al.
patent: 5232873 (1993-08-01), Geva et al.
patent: 5286675 (1994-02-01), Chen et al.

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